机译:倒装芯片叠层可与柔性基板上的有机单晶电接触
Semiconductor Electronics Division, Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA;
Department of Physics, 'Wake Forest University, Winston-Salem, North Carolina 27109, USA;
Semiconductor Electronics Division, Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA;
Semiconductor Electronics Division, Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA;
Semiconductor Electronics Division, Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA;
Semiconductor Electronics Division, Physical Measurement Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA;
Department of Physics, 'Wake Forest University, Winston-Salem, North Carolina 27109, USA;
机译:倒装芯片在有机基材上的底部填充:粘度,表面张力和接触角
机译:通过金属有机化学气相沉积在廉价的柔性金属基板上的高迁移率类单晶GaAs薄膜
机译:柔性基板上的高性能有机单晶晶体管
机译:Z互连有机倒装芯片基板的电气性能
机译:Ga2O 3单晶基板和外延层的生长,表征和接触
机译:弯曲对基于柔性有机单晶的场效应晶体管电特性的影响
机译:具有倒装芯片附件和电气测试结构的柔性聚酰亚胺基板的可靠性研究