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Design and fabrication of an electrical injection metallic bowtie plasmonic structure integrated with semiconductor gain medium

机译:集成半导体增益介质的电注入金属领结等离子体结构的设计与制造

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摘要

We propose and demonstrate a design and fabrication of an electrical injection metallic bowtie (MB) structure integrated with semiconductor gain medium. Our integrated bowtie-semiconductor structure takes the advantage of selective wet chemical etching of InGaAsP, allowing the formation of a bowtie shaped gain structure by a single step etching. The subsequent metal deposition allows the nature integration of gain medium between two bowtie tips. Electroluminescence was observed from fabricated structures at 78 K. Such gain embedded MB structures open the potential for large scale fabrication of plasmonic structures for various applications such as nanolasers and plasmonic generation under electrical injection.
机译:我们提出并演示了与半导体增益介质集成的电注射金属领结(MB)结构的设计和制造。我们集成的领结半导体结构利用InGaAsP的选择性湿法化学蚀刻优势,允许通过一步蚀刻形成领结形增益结构。随后的金属沉积使增益增益介质在两个领结尖端之间自然融合。从制造的结构在78 K下观察到电致发光。这种增益嵌入的MB结构为大规模应用等离子结构的大规模制造打开了潜力,可用于各种应用,例如纳米激光和电注入下的等离子产生。

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  • 来源
    《Applied Physics Letters》 |2013年第9期|091112.1-091112.5|共5页
  • 作者单位

    School of Electrical, Computer, and Energy Engineering, Arizona State University, Tempe, Arizona 85287, USA;

    School of Electrical, Computer, and Energy Engineering, Arizona State University, Tempe, Arizona 85287, USA;

    School of Electrical, Computer, and Energy Engineering, Arizona State University, Tempe, Arizona 85287, USA,COBRA Research Institute, Technische Universiteit Eindhoven, 5600 MB Eindhoven, The Netherlands,P.O. Box 2258, Warwick 6024, Australia;

    School of Electrical, Computer, and Energy Engineering, Arizona State University, Tempe, Arizona 85287, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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