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Thermally enhanced blue light-emitting diode

机译:耐热增强的蓝色发光二极管

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摘要

We investigate thermoelectric pumping in wide-bandgap GaN based light-emitting diodes (LEDs) to take advantage of high junction temperature rather than avoiding the problem of temperature-induced efficiency droop through external cooling. We experimentally demonstrate a thermally enhanced 450 nm GaN LED, in which nearly fourfold light output power is achieved at 615 K (compared to 295 K room temperature operation), with nearly no reduction in the wall-plug efficiency (i.e., electrical-optical energy conversion efficiency) at bias V < hω/q. The LED is shown to work in a mode similar to a thermodynamic heat engine operating with charged carriers pumped into the active region by a combination of electrical work and Peltier heat (phonons) drawn from the lattice. In this optimal operating regime at 615 K, the LED injection current (3.26 A/cm~2) is of similar magnitude to the operating point of common high power GaN based LEDs (5-35 A/cm~2). This result suggests the possibility of removing bulky heat sinks in current high power LED products thus realizing a significant cost reduction for solid-state lighting.
机译:我们研究宽带隙GaN基发光二极管(LED)中的热电泵浦,以利用高结温,而不是避免因外部冷却而引起的温度感应效率下降的问题。我们通过实验证明了一种热增强型450 nm GaN LED,其中在615 K(室温下为295 K)下实现了近四倍的光输出功率,而墙上插头的效率(即电光能量)几乎没有降低转换效率)偏置V <hω/ q。示出LED以类似于热力学热机的模式工作,其中热电发动机通过电功和从晶格汲取的珀耳帖热(声子)的组合而被泵入有源区中。在615 K的最佳工作状态下,LED注入电流(3.26 A / cm〜2)的大小与普通高功率GaN基LED的工作点(5-35 A / cm〜2)相似。该结果表明,有可能去除当前大功率LED产品中笨重的散热器,从而显着降低固态照明的成本。

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  • 来源
    《Applied Physics Letters》 |2015年第12期|121109.1-121109.5|共5页
  • 作者单位

    Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA;

    Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106, USA;

    Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106, USA;

    Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA;

    Materials Department, University of California, Santa Barbara, California 93106, USA;

    Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106, USA ,Materials Department, University of California, Santa Barbara, California 93106, USA;

    Department of Electrical and Computer Engineering, University of California, Santa Barbara, California 93106, USA ,Materials Department, University of California, Santa Barbara, California 93106, USA;

    Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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  • 入库时间 2022-08-18 03:15:19

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