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A metal/Ba_(0.6)Sr_(0.4)TiO_3/SiO_2/Si single film device for charge trapping memory towards a large memory window

机译:一种金属/Ba_(0.6)Sr_(0.4)TiO_3/SiO_2/Si单膜器件,用于向大存储窗口进行电荷陷阱存储

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摘要

In this study, we present a metal/Ba_(0.6)Sr_(0.4)TiO_3/SiO_2/Si (MBOS) structure for charge trapping memory, where the single Ba_(0.6)SrO_4TiO_3 film acts as the blocking layer and charge trapping layer. This MBOS device structure demonstrates excellent charge trapping characteristics, a large memory window up to 8.4 V under an applied voltage of ±12 V, robust charge retention of only 4% charge loss after 1.08 x 10~4s, fast switching rate, and great program/erase endurance. These attractive features are attributed to the high density of defect states in the Ba_(0.6)Sr_(0.4)TiO_3 film and its interdiffusion interface with SiO_2. The properties of defect states in the Ba_(0.6)Sr_(0.4)TiO_3 film are investigated through measurements of photoluminescence and photoluminescence excitation spectroscopy. The energy levels of these defect states are found to be distributed between 2.66 eV and 4.05 eV above the valence band. The inter-diffusion at the Ba_(0.6)Sr_(0.4)TiO_3/SiO_2 interface is observed by high-resolution transmission electron microscopy. More defect sites were created to obtain a better charge trapping capability and retention characteristics.
机译:在这项研究中,我们提出了一种金属/Ba_(0.6)Sr_(0.4)TiO_3/SiO_2/Si(MBOS)结构用于电荷陷阱存储,其中单个Ba_(0.6)SrO_4TiO_3膜充当阻挡层和电荷陷阱层。这种MBOS器件结构具有出色的电荷捕获特性,在±12 V的施加电压下具有高达8.4 V的大存储窗口,在1.08 x 10〜4s后仅稳定的电荷保持4%的电荷损耗,快速的开关速率和出色的编程能力/耐力。这些诱人的特征归因于Ba_(0.6)Sr_(0.4)TiO_3薄膜中缺陷态的高密度及其与SiO_2的相互扩散界面。通过测量光致发光和光致发光激发光谱研究了Ba_(0.6)Sr_(0.4)TiO_3薄膜中缺陷态的性质。发现这些缺陷态的能级分布在价带上方2.66 eV至4.05 eV之间。通过高分辨率透射电镜观察到Ba_(0.6)Sr_(0.4)TiO_3 / SiO_2界面的相互扩散。创建了更多的缺陷部位以获得更好的电荷捕获能力和保留特性。

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  • 来源
    《Applied Physics Letters》 |2017年第22期|223501.1-223501.5|共5页
  • 作者单位

    Key Laboratory of Digital Medical Engineering of Hebei Province, Key Laboratory of Optoelectronic Information Materials of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding 071002, People's Republic of China;

    Key Laboratory of Digital Medical Engineering of Hebei Province, Key Laboratory of Optoelectronic Information Materials of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding 071002, People's Republic of China;

    Key Laboratory of Digital Medical Engineering of Hebei Province, Key Laboratory of Optoelectronic Information Materials of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding 071002, People's Republic of China,Department of Materials Science and Engineering, National University of Singapore, Singapore, Singapore 117576;

    Electrical and Computer Engineering Department, Southern Illinois University Carbondale, Illinois, 1230 Lincoln Drive, Carbondale, Illinois 62901, USA;

    College of Electronic Science and Engineering, Nanjing University of Posts and Telecommunications, Nanjing 210026, People's Republic of China;

    Electrical and Computer Engineering Department, Southern Illinois University Carbondale, Illinois, 1230 Lincoln Drive, Carbondale, Illinois 62901, USA;

    Key Laboratory of Digital Medical Engineering of Hebei Province, Key Laboratory of Optoelectronic Information Materials of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding 071002, People's Republic of China;

    Key Laboratory of Digital Medical Engineering of Hebei Province, Key Laboratory of Optoelectronic Information Materials of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding 071002, People's Republic of China;

    Key Laboratory of Digital Medical Engineering of Hebei Province, Key Laboratory of Optoelectronic Information Materials of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding 071002, People's Republic of China;

    Key Laboratory of Digital Medical Engineering of Hebei Province, Key Laboratory of Optoelectronic Information Materials of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding 071002, People's Republic of China;

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