New Surface Treatment and Microscale/Nanoscale Surface Patterning Using Electrostatically Clamped Stencil Mask

摘要

Stencil lithography is a simple, fast, and versatile technique for patterning surfaces. It is currently used at the microscale for the fabrication of organic field-effect transistors and organic light-emitting devices and also in electron projection lithography. In this study, we propose an inexpensive process based on a silicon-on-insulator (SOI) wafer to fabricate a silicon membrane shadow mask with micro- and nanoscale apertures. This stencil mask enables local deposition of evaporated metal materials on different types of substrates with good resolution. We also demonstrate how an electrostatic clamping system helps in removing the gap between the mask and the surface of the substrate. The use of the stencil mask can be extended to plasma processes such as surface treatment and reactive ion etching. Thus, microstencil lithography has a wide range of applications because of its simplicity and efficiency.