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Contacts on n-type germanium using variably doped zinc oxide and highly doped indium tin oxide interfacial layers

机译:使用可变掺杂的氧化锌和高掺杂的铟锡氧化物界面层在n型锗上的触点

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摘要

The impact of varying interfacial layer (IL) doping on the performance of Ti/IL-Ge contacts is demonstrated using undoped ZnO, aluminum-doped ZnO (AZO), and O-vacancy-doped n~+-ZnO ILs having similar conduction band offsets △E_o with respect to Ti and Ge. Diode and transfer length method measurements show Fermi-level unpinning for all the ILs; however, the contact resistance and its dependence on the IL thickness decrease with Increasing IL doping owing to the reduction in the tunneling resistance. The contact resistivity depends on the IL doping (N_(IL)) as ρ_(c-n~+-ZnO) < ρ_(c-AZO) < ρ_(c-ZnO) for N_(n~+-ZnO) > N_(AZO) > N_(ZnO). Contacts using a highly doped, low △E_o tin-doped In_2O_3 IL exhibit the lowest value, 1.4 × 10~(-7) Ω·cm~2.
机译:使用未掺杂的ZnO,铝掺杂的ZnO(AZO)和O掺杂的n〜+ -ZnO IL证明了不同的界面层(IL)掺杂对Ti / IL / n-Ge接触性能的影响导带相对于Ti和Ge偏移△E_o。二极管和传输长度方法的测量结果表明,所有IL的费米能级都未固定;然而,由于隧穿电阻的减小,随着IL掺杂的增加,接触电阻及其对IL厚度的依赖性降低。对于N_(n〜+ -ZnO)> N_(AZO),接触电阻率取决于IL掺杂(N_(IL))ρ_(cn〜+ -ZnO)<ρ_(c-AZO)<ρ_(c-ZnO) )> N_(ZnO)。使用高掺杂,低△E_o锡掺杂In_2O_3 IL的触点的最小值最低,为1.4×10〜(-7)Ω·cm〜2。

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  • 来源
    《Applied physics express》 |2015年第5期|051302.1-051302.4|共4页
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    Indian Institute of Technology Bombay Nano-fabrication Facility (IITBNF), IIT Bombay, Mumbai 400076, India;

    Indian Institute of Technology Bombay Nano-fabrication Facility (IITBNF), IIT Bombay, Mumbai 400076, India;

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