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Method of moments solution for a printed patch/slot antenna on a thin finite dielectric substrate using the volume Integral equation

机译:使用体积积分方程求解薄有限电介质基板上印刷贴片/缝隙天线的矩量法

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In this paper, a volume integral equation (VIE)-based modeling method suitable for a patch or slot antenna on a thin finite dielectric substrate is developed and tested. Two new key features of the method are the use of proper dielectric basis functions and proper VIE conditioning, close to the metal surface, where the surface boundary condition of the zero tangential E -component must be extended into adjacent tetrahedra. The extended boundary condition is the exact result for the piecewise-constant dielectric basis functions. The latter operation allows one to achieve a good accuracy with one layer of tetrahedra for a thin dielectric substrate and thereby greatly reduces computational cost. The use of low-order basis functions also implies the use of low-order integration schemes and faster filling of the impedance matrix. For some common patch/slot antennas, the VIE-based modeling approach is found to give an error of about 1% or less in the resonant frequency for one-layer tetrahedral meshes with a relatively small number of unknowns. This error is obtained by comparison with fine finite-element method (FEM) simulations, or with measurements, or with the analytical mode matching approach. Hence it is competitive with both the method of moments surface integral equation approach and with the FEM approach for the printed antennas on thin dielectric substrates.
机译:在本文中,开发并测试了基于体积积分方程(VIE)的建模方法,该方法适用于薄型有限介电基片上的贴片或缝隙天线。该方法的两个新的关键特征是在金属表面附近使用适当的介电基函数和适当的VIE调节,其中零切向E分量的表面边界条件必须扩展到相邻的四面体中。扩展边界条件是分段常数介电基函数的精确结果。后一种操作允许使用一层四面体的薄介电基片获得良好的精度,从而大大降低了计算成本。使用低阶基函数还意味着使用低阶积分方案和更快地填充阻抗矩阵。对于某些常见的贴片/缝隙天线,发现基于VIE的建模方法对于未知数相对较少的一层四面体网格,其谐振频率的误差约为1%或更小。通过与精细有限元方法(FEM)仿真进行比较,与测量进行比较或与分析模式匹配方法进行比较,可以得出此误差。因此,它与力矩表面积分方程法和FEM方法在薄介电基片上的印刷天线都具有竞争力。

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