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Antenna-in-Package Design Considerations for Ka-Band 5G Communication Applications

机译:适用于Ka频段5G通信应用的封装天线设计注意事项

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Phased-array modules at frequencies >20 GHz are expected to play an important role for 5G applications. Antenna-in-package (AiP) is a reliable and cost-effective method to realize these phased arrays. This paper introduces a practical Ka-band AiP structure and discusses the antenna element design and implementation tradeoffs. The AiP design is based on multilayer organic buildup substrates that are suitable for phased-array module integration needs and supports both horizontal and vertical polarizations. Measurement results from the fabricated antenna prototypes show 0.8 GHz return loss bandwidth and 3.8-dBi peak gain at 30.5 GHz. Simulation results agree with the measured ones.
机译:频率> 20 GHz的相控阵模块有望在5G应用中发挥重要作用。封装内天线(AiP)是实现这些相控阵的可靠且经济高效的方法。本文介绍了一种实用的Ka波段AiP结构,并讨论了天线元件的设计和实现方案。 AiP设计基于适用于相控阵模块集成需求的多层有机堆积基板,并支持水平和垂直极化。人造天线原型的测量结果显示,回波损耗带宽为0.8 GHz,30.5 GHz时的峰值增益为3.8-dBi。仿真结果与实测结果吻合。

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