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Millimeter-Wave Substrate Integrated Dual Level Gap Waveguide Horn Antenna

机译:毫米波基片集成双电平间隙波导喇叭天线

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Substrate integrated H-plane horn antenna design is introduced based on elevated substrate integrated gap waveguide (E-SIGW) configuration. The E-SIGW topology allows designing the horn from two substrates of different thicknesses. A thin substrate for the feed line to eliminate the radiation losses and a thicker one for the radiating aperture. The proposed configuration allows the H-plane horn aperture to be three times thicker than the feed line substrate, which is not possible with the conventional substrate integrated waveguide technology. The transition between the horn layers enhances the matching bandwidth without any aperture modification. The outer surface of the horn around its aperture is loaded with soft surfaces realized by transverse strips. As a result, more symmetric fan beam radiation patterns with suppressed back lobes are achieved.
机译:基于高架衬底集成间隙波导(E-SIGW)配置,引入了衬底集成H平面号角天线设计。 E-SIGW拓扑允许从厚度不同的两个基板设计喇叭。馈线的薄基板可消除辐射损失,而辐射孔的基板则较厚。所提出的配置允许H平面喇叭孔的厚度是馈线基板的三倍,这是常规基板集成波导技术无法实现的。喇叭层之间的过渡无需任何孔径修改即可提高匹配带宽。喇叭的围绕其孔的外表面装有通过横向条实现的柔软表面。结果,获得了具有被抑制的后瓣的更加对称的扇形束辐射图案。

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