Substrate Integrated Waveguide H-Plane Horn Antenna With Improved Front-to-Back Ratio and Reduced Sidelobe Level

摘要

© 2016 IEEE. A cost-effective way of reducing sidelobe level and improving front-to-back ratio of the substrate integrated waveguide H-plane horn antennas is proposed in this letter. Metal rectangular patches and dielectric loading are integrated to the aperture of the horn antenna, resulting in an increased gain, narrow E-plane beamwidth, and reduced sidelobes and backward radiation. The overall dimensions of the fabricated antenna are 42 × 18.6 mm 2 . The antenna works at 22.7 GHz with a measured gain of 10.1 dBi. A single substrate and a 3.5-mm connector with a transition pin are used to ensure the lowest cost for mass production.