Wafer-scale encapsulation: Controlling MEMS packaging costs

摘要

Microelectromechanical systems (MEMS) technology quickly made the transition from innovative concepts to practical demonstrations and on to early products. The speed of this transition was based on an ability to leverage the manufacturing base of the integrated circuit (IC) industry: plant, equipment, tooling, processes, materials and people. While initial MEMS technology success is based on similarity to the IC industry, current problems limiting MEMS market growth are rooted in fundamental differences between MEMS and ICs. Nowhere are these differences greater than in packaging and assembly. It is commonly cited that packaging accounts for 80% of the cost of a MEMS device, and these costs have shut MEMS out of many mainstream product opportunities.