Stencil Printing for Wafer Bumping: Statistical Process Control

摘要

With the advent of type 5 and type 6 solder paste, and much effort in process development, stencil printing for wafer bumping has arrived. As with stencil printing for PCB assembling, the control of the volume of the solder paste stencil printed "brick" is crucial for high yields in wafer bumping. This need can best be met with an effective statistical process control (SPC) program for the wafer printing process. The purpose of this article is to provide an outline to establish a SPC program for a wafer bumping process.