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首页> 外文期刊>IEEE Transactions on Advanced Packaging >Accurate high speed empirically based predictive modeling of deeplyembedded gridded parallel plate capacitors fabricated in a multilayerLTCC process
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Accurate high speed empirically based predictive modeling of deeplyembedded gridded parallel plate capacitors fabricated in a multilayerLTCC process

机译:多层LTCC工艺中制造的深层嵌入式平行板电容器的基于经验的准确高速预测模型

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摘要

A novel technique is presented for the accurate, rapid, high frequency, predictive modeling of parallel plate capacitors with gridded plates manufactured in a multilayer low temperature cofired ceramic (LTCC) process. The method is empirical in nature and is based on the concept of incrementally constructing the model for a structure from well characterized individual building blocks. Building blocks are characterized by the use of test structures and measurements, and are modeled using passive lumped circuit elements. This method is applied to the predictive modeling of deeply embedded gridded parallel plate capacitor structures. The procedure has been experimentally verified, with accurate predictions of behavior obtained up to the second self resonance for large area gridded parallel plate capacitors. Since lumped element circuits are generated by this method, structure prediction speed is determined by circuit size and simulator small signal analysis time. The method is versatile and is well suited for circuit design applications
机译:提出了一种新颖的技术,可用于在多层低温共烧陶瓷(LTCC)工艺中制造的带有栅板的平行板电容器的精确,快速,高频,预测性建模。该方法本质上是经验性的,并且基于从特征明确的单个构造块中逐步构建结构模型的概念。构建块的特点是使用测试结构和测量,并使用无源集总电路元件进行建模。该方法适用于深埋网格平行板电容器结构的预测模型。该程序已通过实验验证,对于大面积并网平行板电容器,可以准确预测行为,直到第二次自谐振。由于通过这种方法生成集总元件电路,因此结构预测速度取决于电路尺寸和模拟器小信号分析时间。该方法用途广泛,非常适合电路设计应用

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