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Dual-Level Capacitive Micromachined Uncooled Thermal Detector

机译:双层电容微机械加工热检测器

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摘要

This paper presents a novel dual-level capacitive microcantilever-based thermal detector that is implemented in the commercial surface micromachined PolyMUMPs technology. The proposed design is implemented side-by-side with four different single-level designs to enable a design-to-design performance comparison. The dual-level design exhibits a rate of capacitance change per degree Celsius that is over three times higher than that of the single-level designs and has a base capacitance that is more than twice as large. These improvements are achieved because the dual-level architecture allows a 100% electrode-to-detector area, while single-level designs are shown to suffer from an inherent trade-off between sensitivity and base capacitance. In single-level designs, either the number of the bimorph beams or the capacitance electrode can be increased for a given sensor area. The former is needed for a longer effective length of the bimorph for higher thermomechanical sensitivity (i.e., larger tilting angels per degree Celsius), while the latter is desired to relax the read-out integrated-circuits requirements. This thermomechanical response-to-initial capacitance trade-off is mitigated by the dual-level design, which dedicates one structural layer to serve as the upper electrode of the detector, while the other layer contains as many bimorph beams as desired, independently of the former’s area.
机译:本文介绍了一种新型双层电容性微电子的热检测器,其在商业表面微机械聚合物技术中实现。所提出的设计并排实施,具有四种不同的单级设计,以实现设计设计性能比较。双层设计具有每度摄入量的电容变化率超过三倍高于单级设计,并且具有超过两倍的基础电容。实现了这些改进,因为双层架构允许100%电极到探测器区域,而单级设计被示出为敏感性和基极电容之间的固有折衷。在单级设计中,对于给定的传感器区域,可以增加双模光束或电容电极的数量。前者是较长有效长度的Bimorphe的更长的热机理灵敏度(即,每度摄氏度的较大倾斜天使),而后者则可以放宽读出的集成电路要求。通过双层设计减轻了这种热机械响应到初始电容折衷,其使一个结构层用作检测器的上电极,而另一层包含根据需要的多种双芯片光束,独立于前面积。

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