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Breaking Through the Multi-Mesa-Channel Width Limited of Normally Off GaN HEMTs Through Modulation of the Via-Hole-Length

机译:通过对通孔长度的调制突破了常关GaN HEMT的多台面沟道宽度限制

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摘要

We present new normally off GaN high-electron-mobility transistors (HEMTs) that overcome the typical limitations in multi-mesa-channel (MMC) width through modulation of the via-hole-length to regulate the charge neutrality screen effect. We have prepared enhancement-mode (E-mode) GaN HEMTs having widths of up to 300 nm, based on an enhanced surface pinning effect. E-mode GaN HEMTs having MMC structures and widths as well as via-hole-lengths of 100 nm/2 μm and 300 nm/6 μm, respectively, exhibited positive threshold voltages (V th) of 0.79 and 0.46 V, respectively. The on-resistances of the MMC and via-hole-length structures were lower than those of typical tri-gate nanoribbon GaN HEMTs. In addition, the devices not only achieved the E-mode but also improved the power performance of the GaN HEMTs and effectively mitigated the device thermal effect. We controlled the via-hole-length sidewall surface pinning effect to obtain the E-mode GaN HEMTs. Our findings suggest that via-hole-length normally off GaN HEMTs have great potential for use in next-generation power electronics.
机译:我们提出了一种新的常关型GaN高电子迁移率晶体管(HEMT),该晶体管通过调节通孔长度来调节电荷中性屏蔽效应,从而克服了多台沟道(MMC)宽度中的典型限制。基于增强的表面钉扎效应,我们已经准备了宽度高达300 nm的增强模式(E模式)GaN HEMT。具有MMC结构和宽度以及通孔长度分别为100nm /2μm和300nm /6μm的E型GaN HEMT的正阈值电压(V th)分别为0.79和0.46 V. MMC和通孔长度结构的导通电阻低于典型的三栅纳米带GaN HEMT。此外,该器件不仅实现了E模式,而且还改善了GaN HEMT的功率性能,并有效减轻了器件的热效应。我们控制了通孔长度侧壁表面的钉扎效应,以获得E型GaN HEMT。我们的发现表明,通常在GaN HEMT之外的通孔长度具有很大的潜力,可用于下一代电力电子设备。

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