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Enhanced physicochemical properties of polydimethylsiloxane based microfluidic devices and thin films by incorporating synthetic micro-diamond

机译:通过掺入合成的微金刚石增强了基于聚二甲基硅氧烷的微流体装置和薄膜的理化性能

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摘要

Synthetic micro-diamond-polydimethylsiloxane (PDMS) composite microfluidic chips and thin films were produced using indirect 3D printing and spin coating fabrication techniques. Microfluidic chips containing up to 60 wt% micro-diamond were successfully cast and bonded. Physicochemical properties, including the dispersion pattern, hydrophobicity, chemical structure, elasticity and thermal characteristics of both chip and films were investigated. Scanning electron microscopy indicated that the micro-diamond particles were embedded and interconnected within the bulk material of the cast microfluidic chip, whereas in the case of thin films their increased presence at the polymer surface resulted in a reduced hydrophobicity of the composite. The elastic modulus increased from 1.28 for a PDMS control, to 4.42 MPa for the 60 wt% composite, along with a three-fold increase in thermal conductivity, from 0.15 to 0.45 W m−1 K−1. Within the fluidic chips, micro-diamond incorporation enhanced heat dissipation by efficient transfer of heat from within the channels to the surrounding substrate. At a flow rate of 1000 μL/min, the gradient achieved for the 60 wt% composite chip equalled a 9.8 °C drop across a 3 cm long channel, more than twice that observed with the PDMS control chip.
机译:使用间接3D打印和旋涂制造技术生产了合成的微金刚石-聚二甲基硅氧烷(PDMS)复合微流体芯片和薄膜。包含高达60 wt%的微金刚石的微流控芯片已成功浇铸和粘合。研究了芯片和薄膜的理化性质,包括分散模式,疏水性,化学结构,弹性和热学特性。扫描电子显微镜表明,微金刚石颗粒被嵌入并相互连接在流延微流控芯片的块状材料中,而在薄膜的情况下,它们在聚合物表面的存在增加导致复合材料的疏水性降低。弹性模量从PDMS控制的1.28增加到60 forwt%复合材料的4.42 MPa,导热系数增加了三倍,从0.15增加到0.45 W m -1 K −1 。在流体芯片中,微金刚石掺入通过热量从通道内到周围衬底的有效传递而增强了散热。在流速为1000μL/ min的情况下,对于60%(重量)的复合芯片而言,其梯度在3µcm长的通道上等于9.8°C的下降,是PDMS控制芯片所观察到的两倍以上。

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