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Film bulk acoustic resonators integrated on arbitrary substrates using a polymer support layer

机译:使用聚合物支撑层集成在任意基板上的薄膜压电谐振器

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摘要

The film bulk acoustic resonator (FBAR) is a widely-used MEMS device which can be used as a filter, or as a gravimetric sensor for biochemical or physical sensing. Current device architectures require the use of an acoustic mirror or a freestanding membrane and are fabricated as discrete components. A new architecture is demonstrated which permits fabrication and integration of FBARs on arbitrary substrates. Wave confinement is achieved by fabricating the resonator on a polyimide support layer. Results show when the polymer thickness is greater than a critical value, d, the FBARs have similar performance to devices using alternative architectures. For ZnO FBARs operating at 1.3–2.2 GHz, d is ~9 μm, and the devices have a Q-factor of 470, comparable to 493 for the membrane architecture devices. The polymer support makes the resonators insensitive to the underlying substrate. Yields over 95% have been achieved on roughened silicon, copper and glass.
机译:薄膜体声波谐振器(FBAR)是一种广泛使用的MEMS器件,可用作过滤器或用作生化或物理传感的重量传感器。当前的设备架构要求使用声镜或独立膜,并且被制造为分立组件。演示了一种新架构,该架构允许在任意基板上制造和集成FBAR。通过在聚酰亚胺支撑层上制造谐振器来实现波限制。结果表明,当聚合物厚度大于临界值d时,FBAR与使用替代体系结构的设备具有相似的性能。对于工作在1.3–2.2?GHz的ZnO FBAR,d为〜9?μm,并且器件的Q因子为470,与膜架构器件的493相当。聚合物载体使谐振器对下面的基板不敏感。在粗糙化的硅,铜和玻璃上已达到95%以上的产率。

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