Silver deposition precursor molecule trimethylphosphine(hexafluoroacetylacetonato)silver(I) [(hfac)AgP(CH3)3] was used to deposit silver onto water-modified (hydroxyl-terminated) solid substrates. A silicon wafer was used as a model flat surface, and water-predosed ZnO nanopowder was investigated to expand the findings to a common substrate material for possible practical applications. Following the deposition, oxygen plasma was used to remove the remaining organic ligands on a surface and to investigate its effect on the morphology of chemically deposited silver nanoparticles and films. A combination of microscopic and spectroscopic techniques including electron microscopy and x-ray photoelectron spectroscopy was used to confirm the change in the morphology of the deposited material consistent with Ostwald ripening as a result of plasma treatment. Particle agglomeration was observed on the surfaces, and the deposited metallic silver was oxidized to Ag2O following plasma treatment. The fluorine-containing ligands were completely removed. This result suggests that chemical vapor deposition can be used to deposit silver in a very controlled manner onto a variety of substrates using different topography methods and that the post-treatment with oxygen plasma is effective in preparing materials deposited for potential practical applications.
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