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Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices

机译:新兴的封装技术可确保微型植入式设备的长期可靠性

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摘要

The development of reliable long-term encapsulation technologies for implantable biomedical devices is of paramount importance for the safe and stable operation of implants in the body over a period of several decades. Conventional technologies based on titanium or ceramic packaging, however, are not suitable for encapsulating microfabricated devices due to their limited scalability, incompatibility with microfabrication processes, and difficulties with miniaturization. A variety of emerging materials have been proposed for encapsulation of microfabricated implants, including thin-film inorganic coatings of Al2O3, HfO2, SiO2, SiC, and diamond, as well as organic polymers of polyimide, parylene, liquid crystal polymer, silicone elastomer, SU-8, and cyclic olefin copolymer. While none of these materials have yet been proven to be as hermetic as conventional metal packages nor widely used in regulatory approved devices for chronic implantation, a number of studies have demonstrated promising outcomes on their long-term encapsulation performance through a multitude of fabrication and testing methodologies. The present review article aims to provide a comprehensive, up-to-date overview of the long-term encapsulation performance of these emerging materials with a specific focus on publications that have quantitatively estimated the lifetime of encapsulation technologies in aqueous environments.
机译:对于植入式生物医学设备的可靠长期封装技术的发展,对于几十年来体内植入物的安全和稳定运行至关重要。然而,基于钛或陶瓷包装的传统技术由于其有限的可扩展性,与微制造工艺的不兼容以及小型化的困难而不适用于封装微制造的设备。已经提出了各种新兴的材料来封装微型植入物,包括Al2O3,HfO2,SiO2,SiC和金刚石的薄膜无机涂层,以及聚酰亚胺,聚对二甲苯,液晶聚合物,有机硅弹性体,SU等有机聚合物。 -8,与环状烯烃共聚物。尽管尚未证明这些材料具有与传统金属封装一样的气密性,也没有广泛用于经监管批准的用于慢性植入的设备中,但许多研究表明,通过大量制造和测试,它们在长期封装性能方面的前景令人鼓舞方法论。本综述文章旨在提供这些新兴材料的长期封装性能的全面,最新的概述,尤其着重于已定量评估水性环境中封装技术寿命的出版物。

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