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3C-Silicon Carbide Microresonators for Timing and Frequency Reference

机译:用于时序和频率参考的3C碳化硅微谐振器

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摘要

In the drive to miniaturise and integrate reference oscillator components, microelectromechanical systems (MEMS) resonators are excellent candidates to replace quartz crystals. Silicon is the most utilised resonator structural material due to its associated well-established fabrication processes. However, when operation in harsh environments is required, cubic silicon carbide (3C-SiC) is an excellent candidate for use as a structural material, due to its robustness, chemical inertness and high temperature stability. In order to actuate 3C-SiC resonators, electrostatic, electrothermal and piezoelectric methods have been explored. Both electrothermal and piezoelectric actuation can be accomplished with simpler fabrication and lower driving voltages, down to 0.5 V, compared to electrostatic actuation. The vibration amplitude at resonance can be maximised by optimising the design and location of the electrodes. Electrical read out of the resonator can be performed with electrostatic or piezoelectric transduction. Finally, a great deal of research has focused on tuning the resonant frequency of a 3C-SiC resonator by adjusting the DC bias applied to the electrodes, with a higher (up to 160-times) tuning range for electrothermal tuning compared to piezoelectric tuning. Electrothermal tuning lowers the frequency, while piezoelectric tuning can be used to raise the frequency.
机译:在小型化和集成参考振荡器组件的过程中,微机电系统(MEMS)谐振器是替代石英晶体的极佳候选者。硅是最常用的谐振器结构材料,因为它具有相关的公认的制造工艺。但是,当需要在恶劣环境下运行时,立方碳化硅(3C-SiC)由于具有坚固性,化学惰性和高温稳定性,因此非常适合用作结构材料。为了致动3C-SiC谐振器,已经研究了静电,电热和压电方法。与静电致动相比,电热致动和压电致动均可通过更简单的制造和更低的驱动电压(低至0.5 V)实现。通过优化电极的设计和位置,可以使共振时的振动幅度最大化。可以通过静电或压电转换来执行从谐振器的电读出。最后,大量研究集中在通过调节施加到电极上的DC偏压来调谐3C-SiC谐振器的谐振频率,与压电调谐相比,电热调谐的调谐范围更高(高达160倍)。电热调谐可降低频率,而压电调谐可用于提高频率。

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