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Interfacial Microstructure and Properties of Si3N4 Ceramics/Cu/304 Stainless Steel Brazed by Ti40Zr25B0.2Cu Amorphous Solder

机译:Ti40Zr25B0.2Cu非晶焊料钎焊Si3N4陶瓷/ Cu / 304不锈钢的界面组织和性能

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摘要

Si3N4 ceramics and 304 stainless steel were brazed by Ti40Zr25B0.2Cu amorphous solder, and the interfacial microstructure of brazed joint Si3N4 ceramics/Ti40Zr25B0.2Cu/Cu/Ti40Zr25B0.2Cu/304 stainless steel was analyzed. The mechanical properties of the brazed joint were overtly affected by the brazing temperature and Cu foil thickness. The results revealed that the interface structure of the brazed joint might be 304 stainless steel/FeTi/Cu-Zr+Cu-Ti+Fe-Ti/Cu(s,s)/Cu-Zr+Cu-Ti+Fe-Ti/Ti-Si+Zr-Si/TiN/Si3N4 ceramics. The four-point bending strength of the brazed joint decreased sharply as the brazing temperature increased and reached a maximum of 76 MPa at 1223 K. Furthermore, as the Cu foil thickness was increased from 500 μm to 1000 μm, the joint strength rose to 90 MPa at 1223 K.
机译:用Ti40Zr25B0.2Cu非晶钎料钎焊Si3N4陶瓷和304不锈钢,并分析了钎焊Si3N4陶瓷/Ti40Zr25B0.2Cu/Cu/Ti40Zr25B0.2Cu/304不锈钢接头的界面微观结构。钎焊接头的机械性能受钎焊温度和铜箔厚度的明显影响。结果表明,钎焊接头的界面结构可能为304不锈钢/ FeTi / Cu-Zr + Cu-Ti + Fe-Ti / Cu(s,s)/ Cu-Zr + Cu-Ti + Fe-Ti / Ti-Si + Zr-Si / TiN / Si3N4陶瓷。钎焊点的四点弯曲强度随着钎焊温度的升高而急剧下降,并在1223 K时达到最大76 MPa。此外,随着铜箔厚度从500μm增加到1000μm,接头强度提高到90 MPa在1223 K.

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