发光二极管(LED-Light Emitting Diode)照明因其特有的优势逐渐替代传统光源,但芯片结温对LED的光电转化效率、波长和寿命等有重要影响,因此散热是LED应用的瓶颈.设计了模块化的高密度LED照明单元,可根据需要组合以满足不同场合的需求.针对其散热要求,提出一种新的散热结构,采用钎焊连接的方法代替传统散热器中导热膏粘接和机械夹持的部分,有效地减小了封装热阻.通过数值模拟和试验探究了影响散热的主要因素和热通道的瓶颈,并进行了相应的结构优化.试验结果证明,优化后的散热结构能得到至少13％的性能提升.%LED (light emitting diode) lighting has gradually taken place of the traditional lighting. However,the high junction temperature in LED chips has great negative effects on photoelectric conversion efficiency,emitting light wavelength and life. Hence,the thermal dissipation becomes the bottle-neck for the applications of LED lighting. The lighting modules with many powerful LED chips were designed. Furthermore, a new heat dissipation structure was presented to meet the requirement of heat dissipation for these new LED lighting modules. The thermal resistance in the new heat dissipation structure was decreased by using soldering interconnection to replace thermal paste adhesive or mechanical contact between substrate and heatsink and between fins and thermotubes. The efficiency of the new heat dissipation structure is improved more than 13%.
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