陶瓷-金属封接二次金属化研究

摘要

Ceramic-metal sealing process is studied by using microstructure analysis and performance tests.Technological experiments focus on the second metalizing layer.The result shows that using electroplating Cu as the second metalizing layer is feasible,and the quondam second metalizing layer could be cancelled.%本文采用显微结构的分析方法和性能测试手段,以二次金属化层为研究对象开展工艺试验,对陶瓷-金属封接工艺进行了新的探讨.分析结果表明采用电镀Cu作为二次金属化层方案是可行的,并且提出了取消二次金属化层的建议.