高导热金刚石/铜复合热沉的研究

摘要

针对功率半导体器件对高导热、绝缘热沉材料的需求,以高温高压法合成了金刚石/铜复合热沉材料,并沉积金刚石薄膜作为绝缘层.研究结果表明:当金刚石颗粒尺寸为80 ～120μm、金刚石体积百分含量为80％时,复合热沉热导率高达580 W/m·K,并且具有良好的绝缘性.金刚石/铜复合材料在高温高压(6 GPa,1 200 ℃)下形成了部分金刚石骨架作为有效导热通道.%Diamond copper composites,on which diamond film was deposited as the insulating layer,were prepared by high temperature and high pressure( HTHP) sintering method, for the require ments of high thermal conductivity and insulation by power semiconductor devices. The results indicate that a high thermal conductivity value of 580 W/m · K could be achieved when diamond particle diameter is 80 ~ 120 μn and diamond volume percent is 80% . Part of diamond skeleton is formed as effective thermal channels under HTHP(6 GPa,1 200 ℃ ).