Research progress of diamond/copper composites with high thermal conductivity

摘要

Diamond/copper composite has excellent thermal conductivity, which is expected to solve the problem of heat dissipation in high heat flux situation in the future. In this study, the research progress of diamond/copper composite materials is summarized, including the theoretical model, preparation process and preliminary application. Molding technology, composition parameters, interface thickness, interface modification methods and the choice of active elements, the guiding factors of high thermal conductivity in the existing research are analyzed. The modification of the theoretical model, the improvement of the interface modification, the high heat conduction channel brought by the agglomeration of diamond and the near net forming technology are proposed as the future research focus in this field, which provides guidance for the future research.