优化PCB组件热设计的热模拟

摘要

随着高速PCB设计的数量不断的增加,对确保布线、信号完整性和热设计要求造成了很大的困难.为了能够满足PCB设计限制因素数量的增加,对于每一个设计人员来说会面临着非常大的压力.通过热设计模型可以在满足热设计要求和信号完整性要求之间进行权衡折衷.%The increasing density of high-speed PCB designs is making it more difficult to simultaneously meet layout, signal integrity and thermal requirements. Attempting to satisfy an increasing number of PCB design constraints is putting more pressure than ever on designers. Thermal modeling balances the tradeoffs between thermal compliance and signal integrity requirements.