超厚铜多层印制电路板制作工艺探讨

摘要

This paper mainly illustrated the technology of production process of super thick copper 411.6μm(12oz/ft2) multilayer PCB. It effectively solved the technical problem of etching hardly and difficult resin filling by using copper back-etching, laminating and positive etching. The quality of etched line and lamination was assured. It greatly improved the quality of the productions, and meet the customer's special requirements on super thick copper.%　　主要针对411.6mm（单位面积铜重量：12oz/ft2超厚铜箔多层PCB的制作工艺进行研究，采用铜箔反面蚀刻+压合+正面蚀刻的技术，有效解决了超厚铜蚀刻困难和压合填胶困难等业界常见的技术难题，保证线路的蚀刻质量和压合的效果。极大提升了品质，满足了客户的特种需求。