防焊退洗返工浅述

摘要

针对PCB制程中防焊退洗出现的品质问题，从退洗原因、退洗设备构成、退洗物料配制、工艺参数选取等方面，结合实际工作中的生产跟进分析，制定完善的控制方法，预防及保证返工产品性能满足客户需求，减少PCB的报废。%Back wash quality problems of solder resist for PCB manufacturing process arise from in back wash. This paper introduces the back wash equipment constitute, back wash material in manufacturing, process parameter selection and other aspects. It is also combined with the practical work of the production follow-up analysis, the development of improved control methods, prevention and ensuring of heavy product performance to meet customer demand, while reducing scrap.