应用于高频挠性印制电路板的材料

摘要

As circuit design tends to using high frequency, it takes more strict requirements for the reliability of flexible printed circuit board (FPC). Quickly and efficiently spreading of high-frequency needs to optimize the selection of materials such as substrate, adhesives, and copper foil. In this paper we discuss the material properties of FPC for high-frequency applications and present several suggestions.%随着电路设计高频化，对挠性印制电路板的可靠性提出了更加严格的要求。高频信号快速有效地传递，需要优化使用基板材料，粘合剂，铜箔等材料的选择。本文对在高频条件下挠性印制电路板材料的性质进行了分析介绍，并提出了几点建议。