浅谈硫酸盐镀锡

摘要

In circuit board plating process, due to the reason that management or maintenance does not reach the designated position, there often appear unhealthy phenomenon such as uneven tin, tin plating thickness cried, tin bath opacity, independent grommet with etched tin, which lead to scrap. This article focuses on the cause of the bad and the improving measures.%在电路板电镀生产过程中，由于疏于管理或保养不到位，常出现镀锡厚度不均匀、镀锡锡面发黑、镀锡槽液混浊、独立孔环被蚀刻等镀锡不良现象，造成报废。文章主要讨论引起上述不良的原因及改善办法。