印制电路板技术的最新发展动向

摘要

Along with the development of IC chip to fine pitch, more I/O pins ,high speed, as well as the electronic products to be lighter, thinner, smaller, with high properties and more performance, it is necessary for PCB and electronic package to match IC Chip and electronic products. Therefore the requirements to PCB and electronic package in the forms, structures, manufacture processes and technologies, particularly in the used materials, are more and more high. This paper introduces recent development trend of technologies.%随着半导体芯片向微细化多端子高化电子产品向轻薄小高性能多功能方向发展要求采 PCB及电子封装与之匹配进而对二者在形式结构作方法加工工艺特别是材方面提出越来越高要求章介绍印电路板和电子封装技术最新发展动向。