Advances in Integrated Heat Pipe Technology for Printed Circuit Boards

摘要

Designing thermal control systems for electronic products has become very challenginguddue to the continuous miniaturization and increasing performance demands. Two-phaseudcooling solutions, such as heat pipes or vapor chambers, are increasingly used as they offerudhigher thermal coefficients for heat transfer. Following a multidisciplinary and integrativeuddesign approach, new concepts for two-phase cooling solutions for printed circuit boards areudexplored. This paper shows that by integrating thermal design criteria early in the totaluddesign phase, a radical new way of thermal control can be achieved. A new design toudintegrate heat pipe technology with printed circuit board technology is presented. Thisudconcept improves the overall design flexibility of the electronic product significantly andudthermal control is realized and manufactured in a more integrated way. Altogether thisudallows engineers to design a printed circuit board with full integration of thermal controludfunctionality.