谈高频阶梯印制镀金插头线路板制作工艺

摘要

文章重点探讨高频阶梯印制插头线路板的制作工艺。阶梯区设计导通孔及印制线路与插头，线路部分需要印刷防焊，阶梯层粘结要求使用高频PP材料。实践中创新了形成阶梯工艺流程，解决了阶梯层粘结PP压合流胶问题。阶梯区铣空部分采用二次控深铣，利用控深铣残余盖子保护阶梯区印制线路及插头在二次PTH至防焊流程中不被破坏，从而使该类型阶梯板可以成批量制式。%This paper mainly discusses the technology of high-frequency step PCB with gold ifnger. It is necessary to print solder mask on the circuits and use high-frequency PP to adhere the step layers with via, printed circuits and gold finger designed on the step region. The step technology innovated in the practice solves the gumming issue in PP lamination. The second depth-controlled milling is used to mill the left cap in the milled-out region to protect the circuits in the step region and gold ifnger from destruction from the 2nd PTH to solder mask so as to realize mass production of this kind of step plate.