首页> 外国专利> MOUNTING METHOD OF PRINTED WIRING BOARD FOR HIGH FREQUENCY, PRINTED WIRING BOARD MOUNTING MEMBER FOR HIGH FREQUENCY AND ITS MANUFACTURING METHOD

MOUNTING METHOD OF PRINTED WIRING BOARD FOR HIGH FREQUENCY, PRINTED WIRING BOARD MOUNTING MEMBER FOR HIGH FREQUENCY AND ITS MANUFACTURING METHOD

机译:高频印制线路板的安装方法,高频印制线路板的安装方法及其制造方法

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board mounting member for high frequency which can be manufactured without indispensability of high pressure and large-scale contact-bonding equipment, through hole formation after mounting on an object to be mounted and flatness of the object to be mounted, and to provide a manufacturing method of the mounting member. ;SOLUTION: This metal base unified printed wiring board as the printed wiring board mounting member for high frequency is manufactured by bonding a printed wiring board whose back has a mesh GND pattern on a metal base by using conductive adhesive agent, and consists of the printed wiring board 33, the metal base 31 and the conductive adhesive agent 32 which bonds the board 33 and the base 31 on an interface of them. A contact surface of the board 33 with the adhesive agent 32 has the mesh GND pattern 33a.;COPYRIGHT: (C)2001,JPO
机译:解决的问题:提供一种高频印刷电路板安装构件,该印刷电路板安装构件可以在没有高压和大规模接触接合设备的必不可少的情况下制造,在安装到要安装的物体上之后形成通孔以及该物体的平坦度进行安装,并提供安装构件的制造方法。 ;解决方案:此金属基统一印刷电路板作为高频印刷电路板安装部件,是通过使用导电粘合剂将背面具有网状GND图案的印刷电路板粘合在金属基底上而制成的,该印刷电路板的背面布线板33,金属基体31和导电粘合剂32,其将板33和基体31在它们的界面上结合。基板33与粘合剂32的接触表面具有网状GND图案33a 。;版权所有:(C)2001,JPO

著录项

  • 公开/公告号JP2001284803A

    专利类型

  • 公开/公告日2001-10-12

    原文格式PDF

  • 申请/专利权人 NEC CORP;

    申请/专利号JP20000093510

  • 发明设计人 KUSAMITSU HIDEKI;

    申请日2000-03-30

  • 分类号H05K3/44;H01P1/30;H01P3/08;H05K1/05;

  • 国家 JP

  • 入库时间 2022-08-22 01:34:11

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