高厚径比多种孔径选择性树脂塞孔工艺研究

摘要

This article shows PCB resin-plughole technology, using screen-printing technique, which mainly relfected in several aspects such as selection of squeegee, design of plughole template, optimization of squeegee parameters and cure parameters, etc. By applying these techniques, our company realized high aspect ratio of PCB resin-plughole, while no bubbles and depressions, in the range of pore size from 0.15mm to 0.60mm. And these technologies have been tested by experiments that followed.%文章通过选择合适的刮胶、设计树脂塞孔模板、优化刮印及固化参数，利用丝网印刷技术进行电路板树脂塞孔的制作技巧。通过应用这些技巧实现了0.15mm~0.60mm孔径范围内高厚径比孔的无空洞、无凹陷塞孔。并对这些技术进行了实验验证。