谈图形转移制程PCB线路不良的因素

摘要

主要讲述PCB图形转移制程，密集线路因开路、缺口、线残不良而导致的品质报废，通过本次对于异常不良缺陷现状进行现场实际调查跟进研究、分析、总结，提供有效的预防措施及改善不良缺陷的有效经验，达到降低报废提高效率的目的。%The article focuses on the PCB pattern transfer process, the dense lines for open circuit, gap, bad line caused by residual bad quality scrap. Through the actual survey of status quo for abnormal bad defect follow-up research, analysis, summary, the paper provides effective preventive measures to improve the bad defects on the basis of the effective experience to achieve the purpose of reducing scrap and improving efifciency.