rdA package substrate (or printed circuit board) that includes at least one dielectric layer a first inductor structure is at least partially located in the dielectric layer a third interconnect and a second inductor structure. The first inductor structure includes a first interconnect a first via coupled to the first interconnect and a second interconnect coupled to the first via. The third interconnect is coupled to the first inductor structure. The third interconnect is configured to provide an electrical path for a ground signal. The second inductor structure is at least partially located in the dielectric layer. The second inductor is coupled to the third interconnect. The second inductor structure includes a fourth interconnect a second via coupled to the fourth interconnect and a fifth interconnect coupled to the second via. The first and second inductor structures are configured to operate with a capacitor as a 3 harmonic suppression filter.
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