无氰电镀金的研究进展

摘要

In this paper,several kinds of non-cyanide gold plating technologies using sulphite,thiosulfate,sulphite-thiosulfate and hydantoin as complexing agents were comprehensively studied.Electrolyte composition,coordination form of complexing agent and gold ion,gold plating process parameters and various factors that limit the development of each bath system were summarized.The electrodeposition behavior of gold in related bath was also discussed and the development trend of non-cyanide gold plating technology was prospected.%本文重点介绍了亚硫酸盐镀金、硫代硫酸盐镀金、亚硫酸盐-硫代硫酸盐复合配合剂镀金、乙内酰脲镀金等无氰电镀金工艺.综述了每种镀液体系的基本组成、配位剂与金离子的配位形式、镀金工艺参数及限制其发展的各种因素.对相关镀液体系中金的电沉积行为进行了总结,并对未来无氰电镀金工艺的发展方向进行了展望.