ALKALINE, CYANIDE-FREE SOLUTION FOR ELECTROPLATING OF GOLD ALLOYS, A METHOD FOR ELECTROPLATING AND A SUBSTRATE COMPRISING A BRIGHT, CORROSION-FREE DEPOSIT OF A GOLD ALLOY

摘要

The present invention relates to an electroplating solution which is free of cyanides and toxic compounds for the electrodeposition of bright deposits of gold-copper alloys. Thus, substrates are provided which comprise a bright gold-copper alloy deposit which is corrosion resistant according to NFS 80772, ISO 4538 and/or ISO 9227 and has 14 to 22 karats of gold in the alloy. Remarkably, the inventive electroplating solution allows electroplating of gold-copper alloy deposits which have a color matching the Swiss standard ISO 8654 from 0.5 N to 5 N. Furthermore, the invention provides a method for electroplating a gold-copper alloy deposit on a substrate. The inventive electroplating solution may be used for electroplating a substrate selected from the group consisting of decorative substrates, jewelry, watches and eyeglass trade.