一种大功率LED模组的热管理设计

摘要

High-power LED module produces a lot of heat when lighting ,which causes rise of LED junction temperature and very strong worse impact on the lifetime of LED module. The management of high-power LED module heat dissipation becomes research focus of the industry. This paper based on the study in the technology of encapsulation and heat pipe, puts forward a design of management of heat dissipation with combination of COB and heat pipe. The study shows that the design of management of heat dissipation can meet the requirement of high-power LED module heat dissipation with high efficiency of heat dissipation.%由于大功率LED模组在工作时会产生大量热量并导致LED结温上升，对LED模组寿命产生严重影响，大功率LED模组的热管理问题成为了行业的研究重点。通过对封装和热管技术研究，提出了COB与热管技术结合的热管理设计。通过研究发现，该热管理设计能有效提高散热效率，满足了大功率LED模组散热要求。