镀钯键合铜丝的发展趋势

摘要

The plating palladium on copper wire can effectively increase oxidation-resistance and then improve bonding property. The Pd-plated copper bonding wire of superior comprehensive performance will be new material suitable for connecting wire on semiconductor packaging. The developmental situation at home and abroad, the research background, the technology of palladium plating and the comparison among gold wire,copper wire and Pd-plated copper wire are reviewed.%铜丝表面镀钯是提高抗氧化性进而改善键合性能的有效手段.镀钯键合铜丝具有优异的综合性能,是半导体封装材料连接导线的新型材料.综述了镀钯键合铜丝国内外的发展现状、研究背景、镀钯工艺及金丝、铜丝和镀钯铜丝的比较.