分子动力学方法研究铜/环氧树脂界面黏结性能

摘要

The effects of crosslink conversion, temperature and moisture content on the interaction be-tween copper and epoxy were investigated by the molecular dynamics simulation. It was showed that the interaction energy of Cu/epoxy resin was almost independent of the crosslink conversion of the epoxy res-in, whereas it was weakened by increasing temperature and moisture content. Meanwhile, it was revealed that moisture concentrated at the Cu/epoxy interface. A comprehensive understanding of the interfacial degradation and a useful tool for developing new adhesives were provided.%采用分子动力学方法研究了电子封装界面铜/环氧树脂相互作用能，并考虑环氧树脂交联程度、温度和含湿量的影响。研究结果表明，环氧树脂交联程度对铜/环氧树脂界面相互作用能几乎没有影响，而高温和高湿都会使铜/环氧树脂界面黏结性能明显下降。分析表明，湿气含量较高时，湿气穿越环氧树脂层聚集在铜与环氧树脂之间。