金刚石线锯超声振动切割SiC锯切力的实验研究

摘要

在建立金刚石线锯普通切割SiC各锯切参数与锯切力关系的基础上,研究了振动切割中各参数对锯切力的影响机理和锯丝磨损对SiC切割表面质量的影响,并采用单因素进行锯切参数对锯切力和SiC切割表面形貌的试验研究.结果表明:同等条件下,超声振动切割比普通锯切的平均主锯切力明显减小；相对于锯切速度和工件转速,工件进给速度对锯切力的影响更为明显；增大振幅直接扩大了介于工具-工件间的动态容屑空间,有利于排屑.正确选择锯切工艺参数尤其是进给速度和振幅,对锯切力和动态容屑空间的平衡至关重要.%Based on the relationship between processing parameters and cutting force under wire saw fixed diamond abrasive cutting SiC single crystal wafers,this paper studies mechanism for each parameters influencing on the cutting force and the wire saw wear has effect to surface quality of SiC single crystal wafers , the single factor experiment for processing parameters infuencing on cutting force and surface topography is conducted. The results show that: the wire saw with ultrasonic vibration cutting reduce significantly the average main cutting force than that in ordinary wire saw cutting. Compare with the wire saw velocity and part rotation, the part feedrate influence on cutting force more obvious and increasing the amplitude lead to expand directly the dynamic chip space between wire saw-part which is benefit to chip outflowing. It is critical that resonable choice processing parameters, especially the part feedrate and vibration amplitude, to the balance of the cutting force and dynamic chip space.