基于灵敏度及层次分析法的键合头多目标结构优化

摘要

为满足保证键合头动态特性、避免共振条件下达到结构轻量化设计要求，提出基于灵敏度计算参数优选及基于层次分析法最优解提取相结合的多目标优化设计方法。通过有限元仿真计算与模态实验结合研究键合头动态特性验证有限元模型精度。针对拾取臂部件设计参数进行灵敏度分析并提取优化设计变量。用多目标遗传优化算法对拾取臂以一阶固有频率、结构质量为目标优化计算，用层次分析法优选出最佳优化方案。结果表明，优化后拾取臂一阶固有频率提高27．1％，结构质量减轻8．9％，且键合头已避开共振频段达到设计要求。该研究方法具有较高的精度及应用价值。%The flip chip bonding head (FCBR)is a core function component of microelectronic flip chip bonding equipments used to deal with the process of chip picking,dispensing,and bonding.In order to ensure the dynamic characteristics of bonding head and avoid resonance phenomenon and to meet the structural lightweight design requirement,a multi-objective optimization design method was proposed by combining the design parameter filtration based on sensitivity analysis and the optimal solution extraction based on analytic hierarchy process (AHP).The dynamic characteristics of bonding hear were investigated by finite element simulation and modal test.The precision of the finite element model was verified.The optimization design variables were extracted according to the parameter sensitivity calculation and the first order inherent frequency and the structural mass of picking arm were taken as the optimization objectives.The best optimization solution was selected by using AHP.The results show that the first order inherent frequency of picking arm is enhanced by 27.1% and the mass is decreased by 8.9%.The methods presented have higher precision and are of application value.