METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A SUPPORT STRUCTURE ON A WIRE BONDING MACHINE, AND RELATED METHODS

摘要

A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).