混合信号集成电路中的衬底噪声耦合

摘要

In this paper,the substrate noise coupling in the mixed-signal ICs and its effect on the analog/digital circuits are investigated.The heavily doped substrate with an epitaxial layer is adopted.Two benchmark circuits are evaluated.Proper simulation technique for the mixed-signal circuits in SPICE for high speed and high frequency operations is developed.%研究混合信号集成电路中衬底噪声耦合及衬底噪声对模拟/数字电路的影响.采用带外延层的重掺杂型衬底,对混合信号集成电路中研究衬底噪声的两个基准(Benchmark)电路进行了模拟和评价,提出了在高速和高频工作时应用SPICE对混和信号电路进行模拟的正确方法.