首页> 中文期刊> 《上海大学学报(英文版)》 >基于MEMS技术的硅衬底背面减薄结构圆形射频微电感

基于MEMS技术的硅衬底背面减薄结构圆形射频微电感

         

摘要

This paper discusses fabrication and performance of novel circular spiral inductors on silicon. The substrate materials underneath the inductor coil are removed by wet etching process. In the fabrication process, fine polishing of the photoresist is used to simplify the processes and ensure perfect contact between the seed layer and the top of pillars. Dry etching technique is used to remove the seedlayer. The results show that Q-factor of the inductor is greatly improved by removing silicon underneath the inductor coil. The spifrequency of the inductor is about 8.5 GHz. For the inductor of conductor width 80 μm, the peak Q-factor increases to about 17 for inductance of 1. 5 nH in the frequency range of 0.05 - 3.00 GHz.

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