采用溶胶凝胶法(sol-gel)在P型硅基底制备了锂掺杂氧化锌薄膜.以锂掺杂氧化锌薄膜为沟道层,制备了底栅结构的薄膜晶体管.XRD实验结果表明,500℃退火得到的锂掺杂氧化锌薄膜为纤锌矿结构,具有c轴择优取向.SEM实验结果说明,薄膜晶粒大小约为25 nm,尺度分布均匀.电学测试结果显示器件是N沟道增强型.%Li-doped ZnO(ZLO) films were prepared by sol-gel technique on P-type silicon.With ZLO films as channel layers,bottom gate thin film transistors were fabrieated.The XRD results showed the ZLO films were wurtzite structure with c-axis orientation at the heat-treatment of 500 ℃.The SEM experiments indicated that the ZLO films were uniform and the grain size was about 25 nm.The I-V property of ZLO-TFTs implied the devices were N-channel enhanced thin film transistors.
展开▼