采用真空感应熔炼炉制备低熔点Al-Si-Cu-Zn-Sn多元合金钎料,以Cu为主要降低钎料熔点的元素,Zn和Sn作为既降低钎料的熔化温度,又提高钎料的润湿性和流动性的元素.通过对钎料的性能测试表明:该钎料液相线温度为528.8℃,可在560℃钎焊6063铝合金,钎焊接头剪切强度达到母材抗拉强度的80%,并且该钎料具有良好的润湿性和流动性,可以用于锻铝及部分硬铝合金的钎焊.%Vacuum induction melting furnace was used to prepare low melting point Al-Si-Cu-Zn-Sn multi-element alloy solder where Cu was taken as an element for reducing melting point of the solder and Zn and Sn not only for reducing the temperature of the solder fusion but also for increasing the wettability and fluidity of the solder. It was shown by solder performance test, that the liquid's temperature of the solder was 528. 8 ℃, and it could be used to solder 6063 aluminum alloy at 560 ℃, making the strength of solding joint as much as 80% of the strength of base metal. Moreover, the solder exhibited a fine wettability and fluidity, so that could also be used to braze the forged aluminum and some hard aluminum alloy.
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