微焊点的几何尺寸效应

摘要

With electronic products tending to become smaller,lighter and higher in performance,the solder joints used to connect chip and substrate have been miniaturized to just dozens of micron or a few micron.In the mesoscopic scale,the traditional mechanical,electrical and metallographic paramelers for describing micro-joint have been influenced by geometrical size.This must seriously interfere with the evaluation for structure design,reliability and service time of micro-joint.In this paper,the relation between the geometrical size,shape and mechanical,electrical,melallographic performance of micru-joint are summarized.Some currently problems are pointed out.Orienlation in size effect on reliability evaluation is predicted.%随着微电子产品向微型化、高性能方向发展,用于连接芯片与基板的微焊点尺寸也缩小到几十微米甚至几微米.在此细观尺度范围,传统焊点的力学、电学和金属学常数均呈现明显的尺寸效应.这必将对微焊点结构设计、可靠性分析及寿命评估产生重要影响.本文就有关细规尺度下,微焊点的几何尺寸、焊点形态对其微观力学性能、物理及金属学性能的影响进行综合评述.指出了目前研究微焊点可靠性过程中存在的问题,预测了基于几何尺寸效应研究微焊点的结构设计和寿命评估的未来研究趋势.